31 - 40 of 133
bt ic substrate
Selling leads
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...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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...,CMOS,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished ...
2024-12-09 19:38:04
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...Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory ...
2024-12-09 19:38:04
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...IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; ...
2024-12-09 19:38:04
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...Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory ...
2024-12-09 19:38:04
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...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand...
2024-12-09 19:38:04
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...Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is ...
2024-12-09 20:39:36
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...IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
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... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ...
2024-12-09 19:45:11
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...IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ...
2024-12-09 19:45:11
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