bt ic package substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

71 - 80 of 135

bt ic package substrate

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0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics

0.2mm Ultrathin MEMS packaging substrate fabrication for microphone&microelectronics for sale

... MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ... 2024-12-09 19:38:04

Anylayer/Buildup types Sip packaging Substrate manufacture

... electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.24mm; Material ... 2024-12-09 19:38:04

Fingerprint sensors packaging substrate manufacture supporting

...4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic... 2024-12-09 19:38:04

big capacity of memory packaging substrate manufacture

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ... 2024-12-09 19:38:04

MicroLED/MiniLED package substrate manufacture

Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini... 2024-12-09 19:38:04

Sensors package substrate CMOS substrate manufacture supporting

... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

NAND memory package substrate manufacture

... thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap plating

...,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished ... 2024-12-09 19:38:04

BGA/QFN package substrate production for IoT industry semiconductor

...,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0... 2024-12-09 19:38:04

0.26mm BT BGA IC Substrate Board manufacture

... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11

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