China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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bt fr4 memory substrate board

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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bt fr4 memory substrate board

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Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc... 2024-12-09 21:20:17
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ... 2024-12-09 19:38:04
Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ... 2024-12-09 19:38:04
Description Of IC Substrate pcb IC substrate is a technology developed with the continuous progress of semiconductor packaging technology. In the mid... 2024-12-09 19:38:04
Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, ... 2024-12-09 21:20:17
...Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC ... 2024-12-09 19:55:37
...electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand... 2024-12-09 19:38:04
...memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable ... 2024-12-09 19:38:04
...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package... 2024-12-09 19:55:37
...,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand... 2024-12-09 19:57:48
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