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bga package semiconductor substrate
Selling leads
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Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,UDP/USB memory products others; Spec.of substrate production: Mini...
2024-12-09 19:38:04
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Application:Semiconductor package,Sensors electronics package,QFN package,Sensors electronics,Smart electronics; Spec.of Substrate production: Mini...
2024-12-09 19:38:04
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... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located ...
2024-12-09 20:39:36
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Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics...
2024-12-09 19:55:37
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate...
2024-12-09 19:55:37
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...,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,...
2024-12-09 19:57:48
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...package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ...
2024-12-09 19:38:04
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...package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ...
2024-12-09 19:38:04
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Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash ...
2024-12-09 19:55:37
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...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb ...
2024-12-09 19:38:04
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