China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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bga package semiconductor substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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bga package semiconductor substrate

Selling leads
Application:Flash memory pacakge,NAND memory substrate package,Memory electronics,Semiconductor package; Spec.of pcb production: Mini.Line space/width... 2024-12-09 19:38:04
Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) ... 2024-12-09 19:38:04
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini... 2024-12-09 19:38:04
Application:Camera modules electronics,modules electronics,Consumer electronics,Sensors electronics,Semiconductor package; Spec.of pcb production: ... 2024-12-09 19:38:04
...Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of electronic ... 2024-12-09 19:38:04
...package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit ... 2024-12-09 21:20:17
... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant ... 2024-12-09 20:55:08
... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ... 2024-12-09 20:55:08
... slot. It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which ... 2024-12-09 21:20:17
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 20:55:08
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