China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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automotive fcbga memory substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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automotive fcbga memory substrate

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...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ... 2024-12-09 19:45:11
...Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. ... 2024-12-09 19:38:04
...substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-... 2024-12-09 19:45:11
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 20:55:08
... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach ... 2024-12-09 21:20:17
Application:IOT electronics,Automotive electronics,new energy automobile,auto-Driving electronics,consumer electronics,others; Spec.of substrate ... 2024-12-09 19:38:04
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11
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