21 - 30 of 38
4 layer sip package substrate
Selling leads
|
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
2024-12-09 19:45:11
|
|
...,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1...
2024-12-09 19:38:04
|
|
Description Of IC Substrate pcb Advanced packaging must need IC substrate is ,a type of carry material for memory integrated circuit with internal ...
2024-12-09 19:38:04
|
|
...,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1...
2024-12-09 19:38:04
|
|
Description Of IC Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of ...
2024-12-09 19:38:04
|
|
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor ...
2024-12-09 19:55:37
|
|
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line ...
2024-12-09 19:57:48
|
|
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil ...
2024-12-09 19:38:04
|
|
Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...
2024-12-09 19:38:04
|
|
...,Taconic,Others; Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more; Copper:0.5oz or Customize; Layer:1...
2024-12-09 19:38:04
|