1mil mems memory substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

71 - 80 of 129

1mil mems memory substrate

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microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ... 2024-12-09 19:38:04

Semiconductor Package Substrate 12um copper buildup types

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

0.26mm BT BGA IC Substrate Board manufacture

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

25um BT IC Package Substrate Soft gold plating

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ... 2024-12-09 19:45:11

Anylayer/Buildup types Sip packaging Substrate manufacture

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness... 2024-12-09 19:38:04

NAND/FLASH Memory Ic packaging Substrate

...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ... 2024-12-09 19:45:11

line/space 25um FBGA Package Substrate For Memory ic packaging

...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ... 2024-12-09 19:45:11

ENEPIG plating ic package substrate manufacture

...substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable game device-... 2024-12-09 19:45:11

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

...package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / Tablet PC) -.Portable ... 2024-12-09 19:45:11

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