1mil bga substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

11 - 20 of 90

1mil bga substrate

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semiconductor packaging Substrate of DRAM Memory manufacture

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash ... 2024-12-09 19:55:37

L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 19:57:48

MGC brand BT CSP package Substrate Fabrication

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 20:39:36

BT material semiconductor Pacakge Substrate L/S 35/35um

BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate... 2024-12-09 20:39:36

L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ... 2024-12-09 21:20:17

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0... 2024-12-09 19:57:48

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:38:04

OEM ODM semiconductor packaging substrate China mainland

...,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width... 2024-12-09 19:38:04

RF/mmwave module substrate manufacture

... assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width... 2024-12-09 19:38:04

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