11 - 19 of 19
0 29mm finished package chip substrate
Selling leads
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BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
2024-12-09 21:20:17
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...Chip substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory ...
2024-12-09 19:47:52
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Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
2024-12-09 20:55:08
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Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
2024-12-09 21:20:17
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... (25um) Finished thickness:FR4/BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly...
2024-12-09 19:38:04
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...UAV,house electronics,consumer electronics. Product description IC substrate is a type of carry material for integrated circuit with internal ...
2024-12-09 21:20:17
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...Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications (0.3mmt for 1-2-1) Applicable ...
2024-12-09 20:55:08
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...Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold ...
2024-12-09 19:38:04
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...package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space...
2024-12-09 19:38:04
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