China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

0.15mm Thickness 2 Layers IC Package Substrate For memory package

Products Detailed

0.15mm Thickness 2 Layers IC Package Substrate For memory package

Memory Card PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip ...
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Product Tags: 0.15mm Thickness IC Package Substrate   2 Layers IC Package Substrate   FR4 Substrate Printed Circuit Board  
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