wire bonding memory substrate with gold plating manufacture
Products Detailed
wire bonding memory substrate with gold plating manufactureApplication:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... |
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| Product Tags: UL Flexible Printed Circuit Board Multilayer Flexible Printed Circuit Board UL Smooth Printed Circuit Board |
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