China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Products Detailed

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...
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Product Tags: Horexs FR4 Pcb   Ultra Thin FR4 Pcb For Encapsulation   Memory Card Ultra Thin FR4 Pcb  
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