China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

BGA IC Package Substrate With Cap Plated MGC BT material

Products Detailed

BGA IC Package Substrate With Cap Plated MGC BT material

Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable ...
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Product Tags: BGA IC Package Substrate   IC Package Substrate With Cap Plated   Horexs Printed Circuit Board  
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