China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

HOREXS semiconductor ic package substrate With Chip Wire Bonding

Products Detailed

HOREXS semiconductor ic package substrate With Chip Wire Bonding

Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly...
[View Products Detailed]
Product Tags: Horexs Bga Circuit Board   Ultra Thin Bga Circuit Board   Bga Circuit Board With Wire Bonding  
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