Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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multiscene thermally conductive encapsulant

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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multiscene thermally conductive encapsulant

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RoHS Reusable Thermal Pad Material Silicone 8 W/m.K For Network Switch

8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2024-12-09 17:38:39

Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink ... 2025-01-02 00:10:25

Multipurpose 3mm Thermal Pad For GPU SSD Practical Ultra Thin

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

150 Degree Laptop Ultra Soft Thermal Pad Replacement Anti Magnetic 2.5KN/M

Ultra Soft Thermal Pad High breakdown voltage with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2025-01-02 00:10:25

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

Notebook Thermal Pad

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 22:03:00

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2025-01-02 00:10:25

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