Notebook Thermal Pad

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity

Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ thermal silicone sheet with shock absorption and sound absorption effect;
■ High breakdown voltage
■ The main purpose of the thermal conductive silica gel piece is to reduce the thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device. The thermal conductive silica gel piece can fill the gap of the contact surface well.
■ Elongation 60%

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm