Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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multiscene thermally conductive encapsulant

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AOK Computer Heat Silicone Free Thermal Pad 10mm Thickness Durable

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2025-01-02 00:10:25

RoHS Heatproof Non Silicone Thermal Pad , Telecommunication Heat Dissipation Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2025-01-02 00:10:25

DDR RAM Thermal Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 22:03:00

Electrical Isolation Non Silicone Thermal Pad

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2024-12-09 22:03:00

Thickness 0.25 mm Silicone Free Thermal Pad 2 W/m.K For Telecommunications

... Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal ... 2024-12-09 17:19:13

Thickness 0.25 mm Silicone Free Thermal Pad 2 W/m.K For Telecommunications

... Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal ... 2025-01-02 00:10:25

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2025-01-02 00:10:25

Ultrasoft Odorless Conductive Silicone Pad, Heatproof Thermal Gap Filler Material

8 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

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