Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0W/m.K Thermal Conductivity

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force

Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Purchase information:

Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.