China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
4
Home > Products > Thermal Pad Material >

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Browse Categories

Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
View Contact Details

Silicone Thermal Sheet CPU , Odorless Electrical Insulation Sheet Material

Brand Name AOK
Model Number TP800
Certification RoHS, Reach, UL
Place of Origin China
Minimum Order Quantity 1000 pcs
Payment Terms T/T
Delivery Time 13-15 working days
Packaging Details 400 mm x 200 mm
Product Name 8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink
Composition Ceramic Filler + Silicone
Color Pink
Thickness 0.5~10 mm
Dielectric Constant 7.2(@10mhz)
Volume Resistivity 1.0*10^12(Ω.cm)
Thermal Conductivity 8.0 W/m.K
Detailed Product Description
8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink

 

AttributeValueTest Method
CompositionCeramic Filler + Silicone-
ColorPinkVisual
Thickness(mm)0.5~10astm d374
Density(g/cc)3.35ASTM D792
Hardness(shore oo)55±10ASTM D2240
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)>6.0ASTM D149
Dielectric Constant(@10mhz)7.2ASTM D150
Volume Resistivity(Ω.cm)1012ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)8.0±0.5ASTM D5470

 

Product feature
■ Thermal conductivity:8.0 W/m.K
■ High thermal conductivity
The material is soft, with good compressibility, good thermal conductivity and insulation, and a large adjustable range of thickness. It is suitable for filling the cavity. Both sides have natural viscosity and strong operability and maintainability;
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product Tags: Thermal Sheet CPU Silicone   Silicone Thermal Sheet CPU   Odorless Electrical Insulation Sheet Material  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Shenzhen Aochuan Technology Co., Ltd
Subject:
Message:
Characters Remaining: (80/3000)