81 - 90 of 98
semiconductor wafer processing laser equipment
Selling leads
|
Product Description Sapphire ky crystallization furnace kyropoulos foam process growth sapphire crystal 200kg 400kg Kyropoulos bubble method (Ky ...
2025-06-18 18:29:32
|
|
Diamond wire/multi-wire/high-speed/high-precision/descending/oscillating cutting machine equipment introduction Diamond Wire Multi-Wire High-Speed ...
2026-04-30 00:07:55
|
|
Product Description: Sic Silicon carbide substrate 6H-P type on axis 0° Mohs Hardness 9.2 for laser device 6H-P type silicon carbide substrate is a ...
2025-06-18 18:24:04
|
|
... Alumina Ceramic Custom Components High Hardness for Semiconductor Manufacturing Equipment Alumina ceramic custom components are advanced ceramic ...
2026-04-30 00:07:55
|
|
... made material that has a wurtzite crystal structure and probably is the most important semiconductor material as the third generation semi ...
2025-06-18 18:24:19
|
|
...ough PVD batch processing of diamond powders. It combines high thermal conductivity, adjustable coefficient of thermal expansion (CTE), high ...
2026-03-26 19:20:53
|
|
...GaN template grow application Sapphire wafer carriers are manufactured to exacting specifications and offer a stable carrier for processing GaAs...
2025-06-18 18:24:22
|
|
Sapphire Substrate (DSP) Overview The Double Side Polished Sapphire Substrate (DSP) is fabricated from high-purity (>99.99%) single crystal aluminum ...
2025-12-20 01:19:20
|
|
Abstract of Semi-automatic room temperature bonding machine Semi-automatic room temperature bonding machine 2/4/6/8/12inch Compatible material ...
2025-06-18 18:29:42
|
|
SiC Sintering Furnace – High-Temperature Carbonization and Uniform Bonding Solution Product Overview The SiC Sintering Furnace is designed for high...
2026-03-26 19:20:46
|