71 - 80 of 98
semiconductor wafer processing laser equipment
Selling leads
|
Product Description: Silicon carbide wafer Sic 6H-P type Off axis: 2.0° toward Production Grade Research Grade Type 6H-P Sic is made of advanced ...
2025-06-18 18:24:05
|
|
... (SiO₂) through high-temperature melting processes. Renowned for their exceptional thermal resistance, chemical stability, and optical transparency...
2025-07-04 17:08:47
|
|
... designed for high-temperature, corrosive process environments in the semiconductor and photovoltaic industries. It is primarily categorized ...
2025-10-29 12:53:16
|
|
Fiber laser marking machine of overview Fiber Laser Marking Machine 20W-100W for Marking on Stainless Steel/Components The fiber laser marking machine ...
2026-04-30 00:07:55
|
|
End-Pumped laser marking machine of device introduction End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength An end...
2026-04-30 00:07:55
|
|
...Wafer DSP Diameter 304.8mm Customized thickness Product description Sapphire wafers are used for thinning and polishing cadmium gallium arsenide ...
2025-07-04 17:09:00
|
|
... wafer ,optical glass ingots by sapphire ,sapphire optical rods,Sapphire small lens,sapphire bearing 1. What's Sapphire? What advantage sapphire ...
2025-06-18 18:25:36
|
|
Robotic Polishing Machine Main Introduction Robotic Polishing Machine for Flat/Spherical/Aspherical Optical Components Processing Robotic polishing ...
2026-04-30 00:07:55
|
|
4H-N 2/3/4/6/8/12 Inch Silicon Carbide (SiC) Substrate – Prime/Dummy/Research Grade This product series provides high-purity Silicon Carbide (SiC) ...
2025-06-23 15:28:14
|
|
...machined stepped edge. The stepped structure enables accurate axial positioning and stable integration into semiconductor process chambers and ...
2026-04-30 00:07:55
|