21 - 30 of 98
semiconductor wafer processing laser equipment
Selling leads
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...Wafer Indium Phosphide Wafer Semiconductor Substrates 350um 650um Description of InP wafer: InP (Indium phosphide) chips are a commonly used ...
2025-06-18 18:26:53
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6–8 Inch Silicon and SiC Wafer Polishing Line with Quad Heads and Closed-Loop Mounting Product Overview The 6–8 inch Semiconductor Wafer Polishing ...
2026-03-26 19:20:53
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...Wafer Handling - Corrosion & Heat Resistant for Semiconductor Processing Product Overview: Our High Purity SiC Ceramic End Effector is engineered ...
2026-04-30 00:07:55
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...-precision separation of wafers (8"/12") and brittle materials. Utilizing diamond blade technology (30,000-60,000 RPM), it achieves micron-level ...
2026-04-30 00:07:55
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Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding ...
2026-04-30 00:07:55
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...Laser Processing Equipment introduce High-Precision Chromatic Laser Processing Equipment for Gradient Rainbow Effects Colorful laser processing ...
2026-04-30 00:07:55
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...based on ultrashort pulse laser technology, achieving micron-level precision in color marking, microstructure processing, and functional surface ...
2026-04-30 00:07:55
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...Wafer Blank for Optical, Semiconductor, and High-Temperature Applications Product Overview Sapphire square raw wafer blanks are semi-finished ...
2026-04-30 00:07:55
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...Wafer 200mm Diameter (±0.2mm), 725µm Thickness, C-Plane SSP,DSP This high-purity 8-inch (200mm) sapphire wafer features exceptional dimensional ...
2025-06-23 15:28:03
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...wafer cassette SEMI standard wafer carrier container 25pcs Product feature description Multi-chip horizontal wafer box is a common way of wafer ...
2025-06-18 18:28:11
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