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kovar transistor outline package
Selling leads
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... resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have different ...
2025-05-13 09:46:55
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...package Product Model JT-TO Product Formation Material Quantity 1. Base Kovar 1 2. Pin Kovar 4 3. Glass insulator BH-A/K 4 4. Brazing ring HlAgCu28 ...
2025-05-13 09:46:55
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... Ni:4-11.43um. Product formation: Material Quantity 1. Cap 10#Steel 1 2. Welding ring HLAgCu28 1 3. Lead 1 4J29(Kovar) 1 4. Glass insulator BH-G/K ...
2025-05-13 09:46:55
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Product name: High Volume TO Header TO-39 Header Plating: The bottom plate, the lead plating Ni:3-8.9um, the bottom plate and the lead plating Au>=0...
2025-05-13 09:46:55
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Product name: TO and SMD type packages for transistor device Applications: automatic control of machinery and electrical appliances in the fields of ...
2025-05-13 09:46:55
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Product Name TO56 With DC Feedhrough 65Ghz Frequency And Aluminum Nitride Product Model TO56 Product Formation Material Quantity 1. Base SPCC 1 2. Pin ...
2025-05-13 09:46:55
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Product Name Robust Coining Base with A Large Diameter Wire Bond Surface Product Model JOPTEC Plating Coating Fully plating Au or selective plating Au ...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness: >0.45μm Hermeticity: leak rate ≤...
2025-05-13 09:46:55
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...package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...
2025-05-13 09:46:55
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...Package,pin,lid are plated Ni:1.3~11.43um;Package and pins are plated Au≥1.0um Product formation: Material Quantity 1. Cover plate 4J42(42alloy) 1 ...
2025-05-13 09:46:55
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