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encapsulated hermetic electronic packages
Selling leads
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... 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have ...
2025-05-13 09:46:55
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... 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features 1. Fiber optic packages have ...
2025-05-13 09:46:55
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Technical characteristics: Product: Micro channel heat sink Size: 27.00 x 10.80 x 1.50 mm Flatness of chip mounting area: ≤ 2 um Roughness of chip ...
2025-05-13 09:46:55
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... ring HlAgCu28 1 6. Ceramic base Aluminum Nitride 1 Insulation Resistance 500V DC resistance between single pin and base is ≥1*1010Ω Hermeticity ...
2025-05-13 09:46:55
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Product name: Kovar to glass sealing metal package Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating coating: The shell, the ...
2025-05-13 09:46:55
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... Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 ...
2025-05-13 09:46:55
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...Pin2 Kovar 1 Insulation Resistance 500V DC resistance between single pin and base ≥1*1010Ω Hermeticity Leak rate: ≤1*10-3Pa.cm3/s. Product Features ...
2025-05-13 09:46:55
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Product name: Sealed enclosure alloy package for circuit Finish: Fully plating Au or selective plating Au. Plating coating: Plate and lead plating Ni...
2025-05-13 09:46:55
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Product Name Robust Coining Base with A Large Diameter Wire Bond Surface Product Model JOPTEC Plating Coating Fully plating Au or selective plating Au ...
2025-05-13 09:46:55
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Product name: TO and SMD type packages for transistor device Applications: automatic control of machinery and electrical appliances in the fields of ...
2025-05-13 09:46:55
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