Double-Sided PCB 32mil RO4003C Laminate 2u" Immersion Gold Finish

This oversized RF PCB serves as a double-sided long-strip antenna substrate, built on Rogers RO4003C laminate. Measuring 1100mm × 350mm, this 1.1-meter ultra-long circuit board overcomes the common size restrictions seen in regular high-frequency PCB manufacturing, making it a practical choice for long antenna arrays and microwave hardware. The board uses a 0.813mm core with 1oz finished copper. There is no solder mask or silkscreen applied to either side, paired with 2u" immersion gold surface finish to preserve stable high-frequency signal performance and reliable solderability.

PCB Specification

The table below summarises all key physical and fabrication parameters for this long-format RO4003C circuit board.

PCB Stack-up

This 2-layer rigid stack-up features a simple symmetrical layout. It works well for long antenna substrate designs and reduces the risk of warping for extra-large boards.

RO4003C Laminates Introduction

Rogers RO4003C is a woven glass reinforced hydrocarbon/ceramic composite material. It delivers electrical performance comparable to PTFE glass substrates while keeping the easy handling and processing traits of epoxy/glass materials.

RO4003C laminates are available with 1080 or 1674 glass fabric options. Regardless of fabric type, all grades maintain identical electrical specifications, offering tightly controlled dielectric constant and low signal loss. Fabrication follows workflows similar to standard FR-4, which helps cut production costs compared to traditional microwave laminates. Unlike PTFE-based microwave substrates, RO4003C requires no specialised through-hole treatment or extra handling steps.

It should be noted that RO4003C is non-brominated and not rated UL 94 V-0. If your project needs UL94 V-0 flame resistance, RO4835 and RO4350B laminates are viable alternatives.

Features

• Dk of 3.38 +/- 0.05
• Dissipation factor of 0.0027 at 10 GHz
• Low Z-axis coefficient of thermal expansion at 46 ppm/°C

Benefits

• Compatible with multi-layer board (MLB) constructions
• Can be processed like FR-4 with lower manufacturing costs
• Fits performance-critical, high-volume applications
• Cost-competitive for high-frequency electronic projects

Low Outgassing Performance of Rogers Laminates

Several Rogers composite materials satisfy NASA SP-R-0022A low outgassing requirements for space-grade hardware. RT/duroid PTFE composites filled with inorganic fibre and TMM temperature-stable hydrocarbon materials demonstrate excellent resistance to outgassing. Reinforced PTFE laminates maintain thermal stability and consistent low outgassing characteristics. TMM highly crosslinked hydrocarbon laminates do not release gases or chemical by-products at elevated temperatures.

The NASA test procedure uses copper-free etched samples. Specimens weighing 100 to 300 mg are heated inside a copper chamber under vacuum conditions at 125°C over 24 hours. A chrome-plated collector kept at 25°C sits 12.7 mm from the chamber outlet. Tests measure Total Mass Loss (TML), Collected Volatile Condensable Materials (CVCM) and Water Vapor Recovered (WVR), calculated as percentages of the original sample mass. Materials registering TML below 1.0% and CVCM under 0.1% are classified as low outgassing and suitable for spacecraft deployment.

Applications

• Long linear antenna arrays
• Microwave point-to-point communication equipment
• RF sensing modules
• Radar antenna substrates
• High-frequency wireless transmission systems

Conclusion

This 1100 × 350mm oversized RO4003C double-sided PCB addresses the manufacturing hurdles of ultra-long antenna substrates. It combines the well-proven electrical stability of Rogers RO4003C, low-loss signal behaviour and FR-4-like processability. Built as a bare board without solder mask or silkscreen and finished with 2u" immersion gold, this long circuit board is ready for custom RF antenna and microwave system builds. The substrate’s consistent dielectric properties and low thermal expansion maintain reliable signal integrity across temperature shifts, a major advantage for long-strip antenna layouts.