Custom 2-Layer CLTE PCB Immersion Tin High Frequency RF Circuit Board

This PCB is built for high-reliability miniaturized RF and wireless communication applications, constructed as a custom 2-layer rigid board with premium CLTE PTFE composite substrate. With an ultra-thin 0.25mm finished board thickness and a 130.6mm × 40mm footprint held to a strict ±0.15mm dimensional tolerance, the board features immersion tin surface finish. Blue solder mask and white silkscreen are applied exclusively on the top side, while the bottom side remains bare with no protective coating. Built with full through-hole construction and no blind vias, it supports precise 6/8 mil minimum trace and space routing alongside 0.25mm micro-hole fabrication, suiting compact high-density circuit layout requirements. Every board receives 100% comprehensive electrical testing before shipment, adheres to IPC-Class-2 industrial quality standards, and supports stable global supply and custom manufacturing services for specialized high-frequency electronic projects.

PCB Specifications

Engineered with high-performance ceramic filled PTFE dielectric structure, this CLTE 2-layer PCB provides excellent dielectric stability and mechanical robustness for high-frequency RF circuit design. Its standardized fabrication parameters deliver consistent signal transmission performance and long-term operational reliability under millimeter-wave operating conditions.

PCB Stack-up Structure

This 2-layer PCB features a symmetrical ultra-thin stackup layout built around a 0.135 mm CLTE core dielectric substrate. 35μm pure copper foils are evenly laminated to both sides of the core to form a balanced structural design. This well-designed stackup delivers uniform thermal conductivity and stable dielectric performance, effectively preventing signal deviation and structural deformation during high-frequency operation.

CLTE™ Laminate Introduction

CLTE PTFE laminates deliver outstanding dimensional stability paired with low planar thermal expansion, maintaining consistent electrical performance for designs integrating embedded resistors. When compared to most alternative PTFE-based substrates, CLTE achieves one of the lowest levels of batch-to-batch variation, which is critical for high-volume RF assemblies where repeatability and predictable electrical behaviour matter.

This material has decades of proven usage alongside resistor foil. It also supports a broad selection of copper cladding options, including standard electrodeposited copper, reverse-treated copper, and rolled copper foil. This flexibility allows engineers to select the right foil type to match their skin-effect and adhesion requirements. Thanks to its consistent, field-verified performance, CLTE remains a preferred substrate choice for a wide array of ground-based and airborne communication platforms and radar systems.

CLTE™ Standard Material Options

Features and Benefits

• Loss Tangent of 0.0012 at 10 GHz – Cuts signal loss while preserving stable dimensional behaviour
• Low Z-axis CTE of 20 ppm/°C – Protects plated through holes from thermal stress and boosts reliability
• Stable dielectric constant over temperature – Reduces mechanical stress when bonding to ceramic active components
• Compatible with heavy metal backings such as aluminum, brass and copper – Supports robust designs built around embedded resistor networks

Typical Applications

The stable electrical and mechanical characteristics of this CLTE™ two-layer rigid PCB make it suitable for a range of high-frequency markets and challenging operating environments:

• Advanced Driver Assistance Systems (ADAS)
• Patch antennas
• Phased array antennas
• Power amplifiers

Summary

This custom CLTE two-layer PCB is engineered to meet stringent requirements of modern high-frequency RF applications. With immersion tin surface finish and full IPC-Class-2 compliance, every board undergoes complete electrical inspection before dispatch. The controlled stack-up and low-loss CLTE substrate combine to maintain reliable signal performance at microwave frequencies. It is a dependable solution for radar, antenna and ADAS hardware projects across the globe.