Double-Sided Rogers TMM10iPCB 2mm Thick with Immersion Gold Plating

This PCB is a custom double-sided rigid RF circuit built around Rogers TMM10i, an isotropic thermoset ceramic composite substrate engineered for microwave systems that demand predictable high-frequency signal performance. It measures 87.05mm × 46.3mm with a tight dimensional tolerance of ±0.15mm and features immersion gold surface finishing, with no solder mask or silkscreen printed on either side of the board. The design utilises pure through-hole architecture without blind vias, supporting fine 5/6 mil trace and space routing alongside a minimum hole diameter of 0.4mm. Its outer copper layers carry 1oz finished copper weight, paired with 20 μm via plating to ensure consistent electrical interconnection. Every finished circuit undergoes full 100% electrical testing before shipment and is fabricated to IPC-Class-2 quality standards. Gerber RS-274-X design files are accepted for manufacturing, and global shipping service is available.

PCB Specification

Each custom microwave PCB is manufactured under strict dimensional and fabrication controls to preserve signal integrity at microwave frequencies. The table below compiles all key physical specifications, manufacturing rules and surface treatment details for this TMM10i circuit board for your quick reference.

PCB Stack-up

Layer stack-up configuration directly governs impedance behaviour and overall RF performance for microwave PCBs. The following table outlines the stackup arrangement of this 2-layer rigid PCB, listing copper foil and core material from top to bottom.

PCB Statistics

Layout statistics illustrate the circuit complexity as well as pad and via distribution derived directly from the submitted design. This table captures core layout metrics exported from the PCB artwork file.

Rogers TMM10i Introduction

Rogers TMM 10i isotropic thermoset microwave material is a ceramic thermoset polymer composite developed for strip-line and micro-strip circuits requiring reliable plated through-hole performance. TMM10i features an isotropic dielectric constant (Dk). Much like other laminates within the TMM family, TMM10i combines the desirable characteristics of ceramic and PTFE substrates while retaining the simpler processing workflow typical of soft substrates. Unlike many conventional PTFE microwave laminates, TMM10i’s thermoset structure streamlines plating workflows and removes complicated surface preparation steps, delivering reliable dielectric performance alongside excellent processability for prototype and volume microwave projects alike.

Features and Benefits

• Isotropic dielectric constant (Dk) of 9.80 +/- 0.245
• Dissipation factor of 0.0020 at 10GHz
• Thermal coefficient of Dk of -43 ppm/°K
• Coefficient of thermal expansion matched to copper
• Decomposition Temperature (Td) of 425 °C TGA
• Coefficient of Thermal Expansion - x y z : 19ppm/K, 19ppm/K,20ppm/K
• Thermal Conductivity of 0.76W/mk
• Available in a thickness range of 0.0015 to 0.500 inches +/- 0.0015”
• Mechanical properties resist creep and cold flow
• Resistant to process chemicals, reducing damage during fabrication
• Eliminates sodium napthanate pre-treatment before electroless plating
• Thermoset resin construction enables stable, reliable wire-bonding
• Supports repeatable wirebonding performance

Typical Applications

• RF and microwave circuitry
• Power amplifiers and combiners
• Filters and couplers
• Satellite communication systems
• Global Positioning System Antennas
• Patch Antennas
• Dielectric polarizers and lenses
• Chip testers

Quality & Production Information

Fabrication accepts Gerber RS-274-X artwork files. The board complies with IPC-Class-2 standard, and worldwide shipping is supported.

Conclusion

This double-sided Rogers TMM10i microwave PCB delivers dependable high-frequency electrical performance and robust mechanical stability. The material’s isotropic dielectric characteristic and balanced thermal behaviour make it a preferred selection for RF engineers developing microwave, antenna and satellite hardware. With tight dimensional control, comprehensive electrical inspection and global supply options, it serves as a reliable custom circuit solution for high-frequency development projects. The thermoset composite makeup of TMM10i removes the cumbersome pre-plating treatment required for most PTFE substrates, enabling consistent quality for prototype validation and large-scale manufacturing orders.