China RF PCB Board manufacturer
Bicheng Electronics Technology Co., Ltd
We Are Your RF PCB Solution Provider! Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB ISO9001, ISO14001, IATF 16949 certified
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Bicheng Electronics Technology Co., Ltd

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Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng
View Contact Details

Bicheng Electronics Technology Co., Ltd

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Company Profile

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, high-frequency passive components, microstrip and stripline circuits, millimeter-wave equipment, radar systems, and digital RF antennas. The company’s high-frequency PCBs are primarily manufactured using three major high-frequency material brands: Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2. Headquartered in the economically vibrant city of Shenzhen, Bicheng PCB operates with a philosophy rooted in serving small and medium-sized enterprises, offering a wide variety of circuit boards to meet diverse market demands.

 

Main Business & PCB Applications

The company upholds the highest manufacturing standards to deliver products known for exceptional quality, performance, and reliability. In addition to high-frequency PCBs, Bicheng has divisions specializing in FR-4 circuit boards, flexible circuits, and metal-core PCBs, supporting everything from prototyping and small runs to mass production. The company actively develops value-added PCB solutions such as HDI, quick-turn production, impedance control, heavy copper, and backplane boards. This strategic focus enables Bicheng to offer an extended and complementary product range, forming an integrated line that spans from low-end to high-end PCBs. These circuit boards are widely used in home appliances, portable and consumer electronics, medical devices, aerospace, and telecommunications.

 

Main Material Partners

 

                                     

Company Information
Basic Information
Company Name:Bicheng Electronics Technology Co., Ltd
Business Type:Manufacturer,Distributor/Wholesaler,Exporter,Seller
Brands:Bicheng
Employee Number:350~450
Factory Location:6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Trade & Market
Company slogan:

We Are Your RF PCB Solution Provider!

Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB

ISO9001, ISO14001, IATF 16949 certified

OEM Overview:

PCB Pattern Plating

 

 

PCB Washing

 

 

Developing

 

 

Production Line:

 

Bicheng Electronics operates two major production bases, strategically located in Shenzhen and Jiangmen.

 

The Shenzhen factory employs over 300 staff and has a monthly output exceeding 10,000 square meters of PCBs. As a brand-new facility, it specializes in quick-turn prototypes and small-volume production.

 

The Jiangmen factory features two new industrial buildings spanning approximately 15,000 square meters, specifically designed for mass production. Equipped with state-of-the-art automated machinery sourced from Israel, Japan, Germany, and Taiwan, the Jiangmen facility produces up to 30,000 square meters per month for 2- to 10-layer PCBs. The establishment of this plant has significantly strengthened Bicheng’s capacity to supply high-end PCBs to both domestic and global markets.

 

With a strong and diverse product portfolio, Bicheng serves customers worldwide. Our offerings include multi-layer boards (up to 32 layers), flex-rigid combinations, heavy copper PCBs, high-frequency and high-speed boards, and HDI, among other types.

 

We are committed to becoming a leading diversified PCB supplier known for precision-engineered products. Our mission is to create lasting value for our customers while building a promising future for our employees.

 

 

 

About quality management:

Quality Policy

Bicheng has established a comprehensive set of management procedures and approaches to ensure that all PCBs consistently meet customer requirements. These procedures cover the entire production chain, including vendor selection, work-in-progress (WIP) inspection, outgoing delivery inspection, and customer service.

 

Evaluation and Audit of Suppliers

All suppliers must undergo a formal evaluation by Bicheng. Furthermore, we assess and rank our suppliers annually to ensure that all materials consistently meet Bicheng’s quality standards. In line with ISO9001 and ISO14001, we continuously develop and supervise our suppliers, driving them to improve both quality management and environmental performance.

 

Contract Evaluation

Before accepting any order, Bicheng thoroughly reviews and verifies each customer’s requirements to confirm our capability to meet specifications, delivery schedules, and other demands.

 

Creation, Review, and Control of Manufacturing Data

Once customer design data and specifications are submitted to our marketing department, Bicheng verifies all requirements. The data is then converted into manufacturing data through CAM processes. A Manufacturing Instruction (MI) is subsequently generated based on actual production processes and technologies, serving as the guide for fabrication. Each MI must be reviewed by independent engineers and QA engineers before release.

 

Incoming Material Quality Control

All materials are inspected prior to warehousing. We have implemented strict inspection procedures and instructions to control incoming material quality. Advanced precision inspection instruments and apparatus enable accurate assessment of material acceptability. Materials are issued on a first-in, first-out (FIFO) basis. Materials approaching their shelf life trigger an automatic “alarm” to ensure they are used before expiration.

 

Control of Production Process

Full process control is achieved through accurate Manufacturing Instructions (MIs), comprehensive equipment management and maintenance, rigorous process control, strict WIP inspections, and clearly defined working instructions.

 

Final Control and Inspection

All PCBs must pass open/short testing and visual inspection after completing specified physical tests. We utilize various advanced testing systems, including customized probes and flying probe test machines, to guarantee 100% testing of every PCB.

 

Product Delivery Audit

A dedicated FQA (Final Quality Assurance) department inspects PCB products based on customer specifications and requirements using a sampling method. Only qualified PCBs proceed to packaging. Prior to shipment, the FQA also conducts a 100% audit of warehouse packing and shipping items, including product number, customer number, product quantity, and shipping address.

 

Customer Service

We have established a professional customer service team that proactively communicates with customers and addresses feedback in a timely manner. By maintaining a sharp focus on customer needs and expectations, we continuously adjust our service policies and PCB product requirements to better serve our clients.

Services:

 

Design For Manufacture

Serial NO. Procedure Item Manufacturing capability
Large volume S<100 m² Middle volume S<10 m² PrototypeS<1m²
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil6 layer 8mil8-12 layer 10mil14-20 layer 14mil22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um )
13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um
14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick
15 Maximum laminate thickness 4.0mm 6.0mm 7.0mm
16 Laminate alignment accuracy ≤±5 mil ≤±4 mil ≤±4 mil
17 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.drill bit diameter 0.2 mm 0.2 mm 0.2 mm
18 Min.slot router diameter 0.60 mm 0.60 mm 0.60 mm
19 Min.tolerance of PTH slots ±0.15mm ±0.15mm ±0.1mm
20 Max.aspect ratio 1:08 1:12 1:12
21 Hole tolerance ±3mil ±3mil ±3mil
22 Space of via to via 6mil(same net),12mil(different net) 6mil(same net),14mil(different net) 4mil(same net),12mil(different net)
23 Space of component hole to component hole 12mil(same net),16mil(different net) 12mil(same net),16mil(different net) 10mil(same net),14mil(different net)
24 Etching Min.width of etching logo 10mil(18um),12 mil (35um),12 mil(70um) 8mil(18um),10mil(35um),12 mil(70um) 6mil(18um),8 mil(35um),12mil(70um)
25 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2
26 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil
27 Min.BGA pad diameter 12mil 12mil 10mil
28 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
29 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um)
30 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um)
6mil(35um) 5mil(35um) 4mil(35um)
9mil(70um) 8mil(70um) 7mil(70um)
11mil(105um) 10mil(105um) 9mil(105um)
13mil(140um) 12mil(140um) 11mil(140um)
31 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.5mm 0.5mm 0.5mm
32 Min.width of solder mask bridge Green:5mil(35um) Green:4mil(35um) Green:4mil(35um)
33 Yellow:5mil(35um) Yellow:4mil(35um) Yellow:4mil(35um)
34 Blue:5mil(35um) Blue:4mil(35um) Blue:4mil(35um)
35 Black:6mil(35um) Black:6mil(35um) Black:6mil(35um)
36 White:6mil(35um) White:6mil(35um) White:6mil(35um)
37 All of Matt:6mil All of Matt:6mil All of Matt:6mil
38 Green:5mil(70um) Green:4mil(70um) Green:4mil(70um)
39 Yellow:5mil(70um) Yellow:4mil(70um) Yellow:4mil(70um)
40 Blue:5mil(70um) Blue:4mil(70um) Blue:4mil(70um)
41 Black:6mil(70um) Black:6mil(70um) Black:6mil(70um)
42 White:6mil(70um) White:6mil(70um) White:6mil(70um)
43 Open solder mask 4mil(35um) 4mil(35um) 3mil(35um)
44 Solder mask coverage 4mil(35um) 4mil(35um) 3mil(35um)
45 Min.width of solder mask text 9mil(35um) 9mil(35um) 8mil(35um)
46 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um)
47 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um)
48 Silkscreen Min.width of silkscreen text 6mil 6mil 5mil
49 Min.height of silkscreen text 35mil 35mil 30mil
50 Min.space from silkscreen to pads 6mil 6mil 5mil
51 Colour of silkscreen White, Black, Yellow
52 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil
53 Mid distance from carbon ink to pads 12mil 11mil 10mil
54 Peelable mask Peelable mask covers conductor or pads 8mil 7mil 6mil
55 Min.distance from peelable mask to pads 14mil 13mil 12mil
56 Max.via-plug of Silk-screen method 2.0mm 2.0mm 2.0mm
57 Max. via-plug of aluminum foil method 4.5mm 4.5mm 4.5mm
58 Surface finish Thickness of nickel of ENIG 3-5um 3-5um 2-6.35um
59 Thickness of Gold of ENIG 0.05-0.1um
60 Thickness of nickel of Gold finger 3-5um
61 Thickness of Gold of Gold finger 0.1-1.27um
62 Thickness of tin of HASL 2.54-6.35um
63 Thickness of OSP 0.2-0.5um
64 Thickness of tin of Immersion tin 0.2-0.75um
65 Thickness of silver of Immersion silver 0.15-0.75um
66 Contour process Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching
67 Minimum router 0.8mm
68 Min.tolerance of contour ±0.15mm ±0.13mm ±0.1mm
69 Min.distance of milling contour(no copper exposure) 12mil 10mil 8mil
70 Angle of V-CUT 20、30、45、60 ±5 degree
71 Degree of symmetry of V-CUT ±6mil ±5mil ±4mil
72 Tolerance of residual thickness of V-CUT ±6mil ±5mil ±4mil
73 Tolerance of Chamfer angle of Gold finger ±5 degree ±5 degree ±5 degree
74 Tolerance of residual thickness of bevel edge of gold finger ±5mil ±5mil ±5mil
75 Min radius of inner corner 0.4mm
76 Min. distance from edge to V-Cut (no copper exposure) 18mil (1.6mm Thick, 20 degree V-groove cutter) 14mil(1.6mm Thick, 20 degree V-groove cutter) 12mil (1.6mm Thick, 20 degree V-groove cutter)
77 20mil (1.6mm Thick, 30 degree V-groove cutter) 18mil (1.6mm Thick, 30 degree V-groove cutter) 16mil (1.6mm Thick, 30 degree V-groove cutter)
78 24mil (1.6mm Thick, 45 degree V-groove cutter) 22mil (1.6mm Thick, 45 degree V-groove cutter) 20mil (1.6mm Thick, 45 degree V-groove cutter)
79 30mil (1.6mm Thick, 60 degree V-groove cutter) 28mil (1.6mm Thick, 60 degree V-groove cutter) 26mil (1.6mm Thick, 60 degree V-groove cutter)
80 Special tolerance Board thickness of flying probe test 0.6-4.0mm
81 Panel size of flying probe test Size900X600mm, Small size can be compensated through manufacturing procedure
82 Panel size of fixture test method Size460X380mm, Small size can be compensated through manufacturing procedure
83 Board thickness of fixture test method 0.4-6.0mm
84 Tolerance of press-fit hole ±2mil
85 Tolerance of NPTH ±2mil
86 Tolerance of PCB thickness 1.0mm≥PCB thickness, Tolerance ±0.1mm;1.0mm≤PCB thickness, Tolerance ±10%
87 Tolerance of depth of countersunk hole ±0.2mm
88 Depth tolerance of blind slot ±0.2mm
89 Maximum shipment size Size1200X600mmDouble side, no test required
90 Size1000X600mm Multilayer, no test required
91 Minimum shipment size 10X10mm
92 PCB thickness of HASL 0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent )
93 HASL PCB Size Size≤600X460mm
94 PCB thickness 0.15-7.0mm
95 Depth of V groove 0.8-3.2mm
96 Distance of non-continuous v-groove ≥7mm
97 Max. drill diameter Size6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm
98 Max. countersink diameter Size6.5mm Countersink can be used counterbore drill or router
99 Distance of Bevel Size≥11mm Size≥5mm Size≥5mm
100 Thickness of peelable mask 0.2-1.5mm ±0.15mm

 

Our Team:

Every day, we dedicate to make things better, keep moving forward and never stop. We believe that teamwork is the guarantee of success, and our focus on creative process makes us even better.

 

Under the guidance of modern science management and instant information shared through the network technology, a high efficient working environment has been come into being. Skilled manufacturing experience can bring out the best performance of the equipment. You'll enjoy our professional super-value services with our high quality PCB's and flexible cooperation.

 

Your individual requirements can get satisfied at Bicheng and also our success can be achieved by the innovative products and competitive advantages.

 

 

Factory Information
Market name:North America,South America,Western Europe,Eastern Europe,Southeast Asia,Africa,Oceania,Worldwide
Contact Person:Ms.Ivy Deng
Contact Phone:86-755-27374847
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