Bicheng Electronics Technology Co., Ltd
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipment, radar systems, digital radio frequency antenna and other fields worldwide for 18 years. Our high frequency PCBs are mainly built on 3 high frequency material brands: Rogers Corporation, Taconic and Wangling. Dielectric constant ranges from 2.2 to 10.2 etc.
Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.
Main Business & PCB Applications We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. We also have divisions of FR-4 circuit board, flexible circuits and metal core PCBs featured as prototypes, small runs to mass production. We actively research and build such high value added PCB projects as HDI, quick turn, impedance control, heavy copper and backplane board etc. This has made our PCB products generate an effective prolongation and complementation, as well as formation of integrated products line ranging from low-end to high-end.The circuit boards are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.
Main Material Partners
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- Basic Information
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Company Name: Bicheng Electronics Technology Co., Ltd Business Type: Manufacturer,Distributor/Wholesaler,Exporter,Seller Brands: Bicheng Employee Number: 350~450 Factory Location: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103 - Trade & Market
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Company slogan: We Are Your RF PCB Solution Provider!
Rogers PCB, Taconic PCB, Arlon PCB, F4B PCB
ISO9001, ISO14001, IATF 16949 certified
OEM Overview: PCB Pattern Plating
PCB Washing
Developing
Production Line: 
Bicheng Electronics has two major production bases where are located in Shenzhen and Jiangmen. Shenzhen factory has over 300 employees and output PCB more than 10000 square meters per month. The Shenzhen factory is a brand new focusing on quick turn, prototype and small volume production.
The Jiangmen factory has two new industrial buildings that cover about 15,000 square meters, designed for mass production volumes. Brand new automated equipments are introduced from Israel, Japan, German, and Taiwan area. The output of Jiangmen factory for 2-10 layers is up to 30000 square meter per month. The foundation of Jiangmen facility increases our ability to supply high-end PCBs domestically and worldwide.
Our business is facing worldwide. Bicheng has strong and diverse PCB products, covering multi-layer boards up to 32 layers, flex-rigid combination, heavy copper, high frequency high speed, HDI and other types.
We’re committed to become a leading diversified PCB supplier, with precision products, Creating value for customers and create the future for staff.
About quality management: 
Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.Final Control and Inspection
All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.
Customer Service
We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.Services: Design For Manufacture
Serial NO. Procedure Item Manufacturing capability Large volume （S<100 m²） Middle volume （S<10 m²） Prototype（S<1m²） 1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm 2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um) 3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um) 4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um) 5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um) 6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um) 7 Min.distance from drill to conductor 4 Layer 10mil，6 layer 10mil，8-12 layer 12mil 4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil 4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil 8 Min.width of annular ring on inner layer 4 Layer 10mil（35um），≥6 Layer 14mil（35um） 4 Layer 8mil(35um)，≥6 layer 12mil（35um） 4 Layer 6mil（35um），≥6 Layer 10mil（35um） 9 Inner layer isolation ring width(Min) 10mil （35um） 8mil （35um） 6mil （35um） 10 Min.via pad diameter 20mil （35um） 16mil （35um） 16mil （35um） 11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil（35um） 12 mil（35um）） 8 mil（35um） 12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um ) 4 OZ ( 140 um ) 6 OZ( 210 um ) 13 Core with different copper foil on both sides / 18/35,35/70 um 18/35,35/70 um 14 Laminating Tolerance of laminate thickness ±10% PCB thick ±10% PCB thick ±8% PCB thick 15 Maximum laminate thickness 4.0mm 6.0mm 7.0mm 16 Laminate alignment accuracy ≤±5 mil ≤±4 mil ≤±4 mil 17 Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.drill bit diameter 0.2 mm 0.2 mm 0.2 mm 18 Min.slot router diameter 0.60 mm 0.60 mm 0.60 mm 19 Min.tolerance of PTH slots ±0.15mm ±0.15mm ±0.1mm 20 Max.aspect ratio 1:08 1:12 1:12 21 Hole tolerance ±3mil ±3mil ±3mil 22 Space of via to via 6mil(same net)，12mil(different net) 6mil(same net)，14mil(different net) 4mil(same net)，12mil(different net) 23 Space of component hole to component hole 12mil(same net)，16mil(different net) 12mil(same net)，16mil(different net) 10mil(same net)，14mil(different net) 24 Etching Min.width of etching logo 10mil(18um)，12 mil (35um)，12 mil(70um） 8mil(18um)，10mil(35um)，12 mil(70um） 6mil(18um)，8 mil(35um)，12mil(70um） 25 Etch factor 1.6-2.2 1.6-2.2 1.6-2.2 26 Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.via pad diameter 20mil 16mil 16mil 27 Min.BGA pad diameter 12mil 12mil 10mil 28 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um) 5/5mil(35um) 4/4mil(35um) 3/4mil(35um) 7/9mil(70um) 6/8mil(70um) 6/7mil(70um) 9/11mil(105um) 8/10mil(105um) 8/9mil(105um) 13/13mil(140um) 12/12mil(140um) 12/11mil(140um) 29 Minimum grid 10/10mil(35um) 8/8mil(35um) 4/8mil(35um) 30 Min.space (conductor to pad, pad to pad) 6mil(18um) 5mil(18um) 4mil(18um) 6mil(35um) 5mil(35um) 4mil(35um) 9mil(70um) 8mil(70um) 7mil(70um) 11mil(105um) 10mil(105um) 9mil(105um) 13mil(140um) 12mil(140um) 11mil(140um) 31 Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Maximum via-plug diameter 0.5mm 0.5mm 0.5mm 32 Min.width of solder mask bridge Green:5mil（35um） Green:4mil（35um） Green:4mil（35um） 33 Yellow：5mil（35um） Yellow：4mil（35um） Yellow：4mil（35um） 34 Blue：5mil（35um） Blue：4mil（35um） Blue：4mil（35um） 35 Black：6mil（35um） Black：6mil（35um） Black：6mil（35um） 36 White:6mil（35um） White:6mil（35um） White:6mil（35um） 37 All of Matt：6mil All of Matt：6mil All of Matt：6mil 38 Green:5mil（70um） Green:4mil（70um） Green:4mil（70um） 39 Yellow：5mil（70um） Yellow：4mil（70um） Yellow：4mil（70um） 40 Blue：5mil（70um） Blue：4mil（70um） Blue：4mil（70um） 41 Black：6mil（70um） Black：6mil（70um） Black：6mil（70um） 42 White:6mil（70um） White:6mil（70um） White:6mil（70um） 43 Open solder mask 4mil(35um) 4mil(35um) 3mil(35um) 44 Solder mask coverage 4mil(35um) 4mil(35um) 3mil(35um) 45 Min.width of solder mask text 9mil(35um) 9mil(35um) 8mil(35um) 46 Min.thickness of Solder mask 9um(35um) 9um(35um) 9um(35um) 47 Max.thickness of solder mask 30um(35um) 30um(35um) 30um(35um) 48 Silkscreen Min.width of silkscreen text 6mil 6mil 5mil 49 Min.height of silkscreen text 35mil 35mil 30mil 50 Min.space from silkscreen to pads 6mil 6mil 5mil 51 Colour of silkscreen White, Black, Yellow 52 Carbon ink Carbon ink covers conductor or pads 14mil 13mil 12mil 53 Mid distance from carbon ink to pads 12mil 11mil 10mil 54 Peelable mask Peelable mask covers conductor or pads 8mil 7mil 6mil 55 Min.distance from peelable mask to pads 14mil 13mil 12mil 56 Max.via-plug of Silk-screen method 2.0mm 2.0mm 2.0mm 57 Max. via-plug of aluminum foil method 4.5mm 4.5mm 4.5mm 58 Surface finish Thickness of nickel of ENIG 3-5um 3-5um 2-6.35um 59 Thickness of Gold of ENIG 0.05-0.1um 60 Thickness of nickel of Gold finger 3-5um 61 Thickness of Gold of Gold finger 0.1-1.27um 62 Thickness of tin of HASL 2.54-6.35um 63 Thickness of OSP 0.2-0.5um 64 Thickness of tin of Immersion tin 0.2-0.75um 65 Thickness of silver of Immersion silver 0.15-0.75um 66 Contour process Method of contour process CNC milling, V-CUT, Break-out tap, break-out holes, Punching 67 Minimum router 0.8mm 68 Min.tolerance of contour ±0.15mm ±0.13mm ±0.1mm 69 Min.distance of milling contour(no copper exposure) 12mil 10mil 8mil 70 Angle of V-CUT 20、30、45、60 ±5 degree 71 Degree of symmetry of V-CUT ±6mil ±5mil ±4mil 72 Tolerance of residual thickness of V-CUT ±6mil ±5mil ±4mil 73 Tolerance of Chamfer angle of Gold finger ±5 degree ±5 degree ±5 degree 74 Tolerance of residual thickness of bevel edge of gold finger ±5mil ±5mil ±5mil 75 Min radius of inner corner 0.4mm 76 Min. distance from edge to V-Cut (no copper exposure) 18mil (1.6mm Thick, 20 degree V-groove cutter) 14mil(1.6mm Thick, 20 degree V-groove cutter) 12mil (1.6mm Thick, 20 degree V-groove cutter) 77 20mil (1.6mm Thick, 30 degree V-groove cutter) 18mil (1.6mm Thick, 30 degree V-groove cutter) 16mil (1.6mm Thick, 30 degree V-groove cutter) 78 24mil (1.6mm Thick, 45 degree V-groove cutter) 22mil (1.6mm Thick, 45 degree V-groove cutter) 20mil (1.6mm Thick, 45 degree V-groove cutter) 79 30mil (1.6mm Thick, 60 degree V-groove cutter) 28mil (1.6mm Thick, 60 degree V-groove cutter) 26mil (1.6mm Thick, 60 degree V-groove cutter) 80 Special tolerance Board thickness of flying probe test 0.6-4.0mm 81 Panel size of flying probe test Size≤900X600mm, Small size can be compensated through manufacturing procedure 82 Panel size of fixture test method Size≤460X380mm, Small size can be compensated through manufacturing procedure 83 Board thickness of fixture test method 0.4-6.0mm 84 Tolerance of press-fit hole ±2mil 85 Tolerance of NPTH ±2mil 86 Tolerance of PCB thickness 1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10% 87 Tolerance of depth of countersunk hole ±0.2mm 88 Depth tolerance of blind slot ±0.2mm 89 Maximum shipment size Size≤1200X600mm（Double side, no test required） 90 Size≤1000X600mm（ Multilayer, no test required） 91 Minimum shipment size 10X10mm 92 PCB thickness of HASL 0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent ) 93 HASL PCB Size Size≤600X460mm 94 PCB thickness 0.15-7.0mm 95 Depth of V groove 0.8-3.2mm 96 Distance of non-continuous v-groove ≥7mm 97 Max. drill diameter Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ） 98 Max. countersink diameter Size≤6.5mm Countersink can be used counterbore drill or router） 99 Distance of Bevel Size≥11mm Size≥5mm Size≥5mm 100 Thickness of peelable mask 0.2-1.5mm ±0.15mm Our Team: 
Every day, we dedicate to make things better, keep moving forward and never stop. We believe that teamwork is the guarantee of success, and our focus on creative process makes us even better.
Under the guidance of modern science management and instant information shared through the network technology, a high efficient working environment has been come into being. Skilled manufacturing experience can bring out the best performance of the equipment. You'll enjoy our professional super-value services with our high quality PCB's and flexible cooperation.
Your individual requirements can get satisfied at Bicheng and also our success can be achieved by the innovative products and competitive advantages.
- Factory Information
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Market name: North America,South America,Western Europe,Eastern Europe,Southeast Asia,Africa,Oceania,Worldwide Contact Person: Ms.Ivy Deng Contact Phone: 86-755-27374847