fr4 fingerprint recognition pcb

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

31 - 37 of 37

fr4 fingerprint recognition pcb

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NAND memory package substrate manufacture

... thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

big capacity of memory packaging substrate manufacture

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ... 2024-12-09 19:38:04

Horexs Ultra thin MEMS package substrate manufacture supporting

...PCB which have Capacitor and Resistor in it Application:MEMS semiconductor,MEMS package,MEMS,CMOS,IC substrate,acoustics electronics,pressure ... 2024-12-09 19:38:04

Camera Module substrate manufacture supporting China

... thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:38:04

0.15mm Thickness 2 Layers IC Package Substrate For memory package

...PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ... 2024-12-09 19:47:52

BT material semiconductor Pacakge Substrate L/S 35/35um

...,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand ... 2024-12-09 20:39:36

ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

...Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material ... 2024-12-09 20:39:36

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