China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
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bt wire bonding substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu
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bt wire bonding substrate

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... packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 19:57:48
... packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 21:20:17
...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand... 2024-12-09 19:38:04
... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,... 2024-12-09 19:38:04
... packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) ... 2024-12-09 20:39:36
... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11
... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... 2024-12-09 19:45:11
Description Of IC Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of ... 2024-12-09 19:38:04
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal ... 2024-12-09 21:20:17
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ... 2024-12-09 19:38:04
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