China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

Products Detailed

Precision 0.15mm IC Packaging Substrate Fabrication 4 Layer Electrolytic Foil Processing

Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR...
[View Products Detailed]
Product Tags: Precision IC Packaging Substrate Fabrication   BT IC Substrate   Electrolytic Foil IC Substrate  
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