China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
Home > Products > IC Package Substrate > Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip > show pictures
Browse Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

Products Detailed

Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
[View Products Detailed]
Product Tags: BOC Package Substrate High Speed   High Density BOC Package Substrate   soft gold Chip Substrate  
Related Products
China memory IC substrate manufacture for DDR/LPDDR factory

memory IC substrate manufacture for DDR/LPDDR

China FCCSP Flipchip package substrate manufacture factory

FCCSP Flipchip package substrate manufacture

China High-Performance SiP Package Substrate for IoT Electronics factory

High-Performance SiP Package Substrate for IoT Electronics

China MEMS package substrate manufacture factory

MEMS package substrate manufacture

China FCBGA/BGA package substrate manufacture factory

FCBGA/BGA package substrate manufacture

China semiconductor FCCSP package substrate manufacture in HOREXS factory

semiconductor FCCSP package substrate manufacture in HOREXS

Email to this supplier
 
From:
Enter your Email please.
To: HongRuiXing (Hubei) Electronics Co.,Ltd.
Subject:
Message:
Characters Remaining: (80/3000)
 
Home | Products | Suppliers | About Us | 公司概况
Terms of user - Intellectual Property Rights (IPR) Protection Policy - Privace Policy
Copyright © 2011-2026 everychina.com.cn. All rights reserved.