Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...

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Product Tags: Soft Gold CSP Package Substrate CSP Package Substrate 0.4mm BT MCP Package Substrate

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