MCP package Substrate 0.5oz Copper Customize BT Material

Products Detailed
MCP package Substrate 0.5oz Copper Customize BT MaterialMCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei ... |
[View Products Detailed] |
Product Tags: Immersion Gold FR4 Substrate 0.5oz Copper MCP Substrate MCP FR4 Substrate |
Related Products
![]() |
L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL |
![]() |
BT material BGA semiconductor package Substrate production |
![]() |
4 Layer buildup types semiconductor Package Substrate production |
![]() |
MCP package Substrate 0.5oz Copper Customize BT Material |
![]() |
ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate |
![]() |
BT material semiconductor Pacakge Substrate L/S 35/35um |
Email to this supplier