BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG
Products Detailed
BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIGApplication:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line ... |
| [View Products Detailed] |
| Product Tags: NAND Memory Substrate Board BT FR4 Memory Substrate Board ENEPIG FR4 Package Substrate |
Related Products
|
L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL |
|
BT material BGA semiconductor package Substrate production |
|
4 Layer buildup types semiconductor Package Substrate production |
|
MCP package Substrate 0.5oz Copper Customize BT Material |
|
ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate |
|
BT material semiconductor Pacakge Substrate L/S 35/35um |
Email to this supplier