ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
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ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw materialApplication:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics... |
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| Product Tags: Half Hole BGA Substrate ENEPIG BGA Substrate BT FR4 Package Substrate |
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