China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
Home > Products > IC Package Substrate > finleLine Space IC Package Substrate for Wearable and Automotive Electronics > show pictures
Browse Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

Products Detailed

finleLine Space IC Package Substrate for Wearable and Automotive Electronics

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
[View Products Detailed]
Product Tags: FBGA IC Packaging Substrate   FR4 IC Packaging Substrate   FBGA Semiconductor Substrate  
Related Products
China memory IC substrate manufacture for DDR/LPDDR factory

memory IC substrate manufacture for DDR/LPDDR

China FCCSP Flipchip package substrate manufacture factory

FCCSP Flipchip package substrate manufacture

China High-Performance SiP Package Substrate for IoT Electronics factory

High-Performance SiP Package Substrate for IoT Electronics

China MEMS package substrate manufacture factory

MEMS package substrate manufacture

China FCBGA/BGA package substrate manufacture factory

FCBGA/BGA package substrate manufacture

China semiconductor FCCSP package substrate manufacture in HOREXS factory

semiconductor FCCSP package substrate manufacture in HOREXS

Email to this supplier
 
From:
Enter your Email please.
To: HongRuiXing (Hubei) Electronics Co.,Ltd.
Subject:
Message:
Characters Remaining: (80/3000)
 
Home | Products | Suppliers | About Us | 公司概况
Terms of user - Intellectual Property Rights (IPR) Protection Policy - Privace Policy
Copyright © 2011-2025 everychina.com.cn. All rights reserved.