China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

Products Detailed

CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate ...
[View Products Detailed]
Product Tags: BGA IC Packaging Substrate   CSP IC Packaging Substrate   4 Layer BT MSAP Substrate  
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