China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Products Detailed

Tenting process 25um DRAM IC package Substrate BT material 4 Layer

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
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Product Tags: DRAM IC Substrate Packaging Board   25um IC Substrate Packaging Board   BT MSAP Substrate  
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