China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Anylayer/Buildup types Sip packaging Substrate manufacture

Products Detailed

Anylayer/Buildup types Sip packaging Substrate manufacture

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
[View Products Detailed]
Product Tags: Horexs PCB   Gold Plated RAM PCB   0.8mm RAM PCB Board  
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