Sip package substrate BT material 4 layer ENEPIG

Products Detailed
Sip package substrate BT material 4 layer ENEPIGApplication:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space... |
[View Products Detailed] |
Product Tags: Custom TF Card RAM PCB FR4 RAM PCB BT Camera Circuit Board |
Related Products
Email to this supplier