China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
7
Home > Products > Sip Package Substrate > Sip package substrate BT material 4 layer ENEPIG > show pictures
Browse Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

Sip package substrate BT material 4 layer ENEPIG

Products Detailed

Sip package substrate BT material 4 layer ENEPIG

Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space...
[View Products Detailed]
Product Tags: Custom TF Card RAM PCB   FR4 RAM PCB   BT Camera Circuit Board  
Related Products
China Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System factory

Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

China Anylayer/Buildup types Sip packaging Substrate manufacture factory

Anylayer/Buildup types Sip packaging Substrate manufacture

China Sip package substrate BT material 4 layer ENEPIG factory

Sip package substrate BT material 4 layer ENEPIG

Email to this supplier
 
From:
Enter your Email please.
To: HongRuiXing (Hubei) Electronics Co.,Ltd.
Subject:
Message:
Characters Remaining: (80/3000)
 
Home | Products | Suppliers | About Us | 公司概况
Terms of user - Intellectual Property Rights (IPR) Protection Policy - Privace Policy
Copyright © 2011-2026 everychina.com.cn. All rights reserved.