China BGA Substrate manufacturer
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
6
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HongRuiXing (Hubei) Electronics Co.,Ltd.

City: shenzhen

Country/Region:china

Tel:86-0752-6166099

Contact Person:
Mr.Mark Liu View Contact Details

JEDEC Standard eMCP IC Package Substrate Fabrication

Products Detailed

JEDEC Standard eMCP IC Package Substrate Fabrication

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card...
[View Products Detailed]
Product Tags: eMCP IC Package Substrate   eMCP Pcb Board Fabrication   UL Pcb Board Fabrication  
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