China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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networking thermal gap filler

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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networking thermal gap filler

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1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 17:19:13
1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Attribute Value Test Method Composition Ceramic filler + ... 2024-12-09 22:03:00
0.5mm Thickness Green Silicone Free Thermal Pad For Hard Disc Driver Attribute Value Test Method Composition Acrylate - Color Green Visual Thickness... 2024-12-09 17:19:13
0.5mm Thickness Green Silicone Free Thermal Pad For Hard Disc Driver Attribute Value Test Method Composition Acrylate - Color Green Visual Thickness... 2025-01-02 00:10:25
Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 17:19:13
Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Attribute Value Test Method Composition Ceramic filler + Silicone - Color... 2024-12-09 22:03:00
Green thermal rubber pad Thermal Conductive Pad With 5.0W/m.K For Power Supplies thermal gap filler Attribute Value Test Method Composition Ceramic ... 2024-12-09 17:19:13
Green thermal rubber pad Thermal Conductive Pad With 5.0W/m.K For Power Supplies thermal gap filler Attribute Value Test Method Composition Ceramic ... 2025-01-02 00:10:25
Green Silicone High Thermal Conductive Pad With 5.0W/m.K For cpu thermal gap filler Attribute Value Test Method Composition Ceramic Filler + Silicone ... 2024-12-09 17:19:13
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