Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

Electronic silicone gap filler Potting Compound Encapsulant Multiscene Practical

Brand Name	AOK
Model Number	GF
Certification	RoHS, Reach, UL
Place of Origin	China
Minimum Order Quantity	400ml(200ml each part)
Payment Terms	T/T
Delivery Time	13-15working days
Packaging Details	50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Product Name	1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant
Usage Temperature	-40~150（℃）
Thermal Resistance	0.15 (℃-in2/W)0.1mm@50psi
Dielectric Constant	5.5（@10mhz）
Flammability	V-0
Thermal conductivity	0.8（W/m.K）

Detailed Product Description

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant

Attribute	Value	Test Method
Composition	Ceramic filler + Silicone	-
Color/Component A	White	Visual
Color/Component B	Sliver Grey	Visual
Density(g/cc)	1.8	ASTM D792
Usage Temperature(℃)	-40~150	--
Electrical
Breakdown Voltage(kv/mm)	≥10.0	ASTM D149
Dielectric Constant(@10mhz)	5.5	ASTM D150
Volume Resistivity(Ω.cm)	1.0*10¹⁵	ASTM D257
Flammability	V-0	UL94
Thermal
Thermal conductivity(W/m.K)	0.8	ASTM D5470
Viscosity/Component A (cps)	4500	ASTM D2196
Viscosity/Component B (cps)	4500	ASTM D2196
Hradness,after cure(shore OO)	60	ASTM D22240
Working Time@25℃(min)	30	ISO 9048

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

Product Tags: Electronic Gel Potting Compound Multiscene Gel Potting Compound Practical Electronic Epoxy Encapsulant Potting Compounds

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