Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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networking thermal gap filler

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RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2025-01-02 00:10:25

3W/m.K Multipurpose Thermal Conductive Pad Heatsink For Networking

Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + ... 2024-12-09 17:19:13

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

RoHS Reusable Thermal Pad Material Silicone 8 W/m.K For Network Switch

8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

3W/m.K Multipurpose Thermal Conductive Pad Heatsink For Networking

Low thermal resistance 3W/m.K thermal Conductive pad for Networking and Telecommunications Attribute Value Test Method Composition Ceramic Filler + ... 2025-01-02 00:10:25

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2025-01-02 00:10:25

RoHS Reusable Thermal Pad Material Silicone 8 W/m.K For Network Switch

8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2025-01-02 00:10:25

1.2 W/m.K Multipurpose Thermal Conductive Pad For Laptop LED Heatsink

1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic ... 2024-12-09 17:19:13

Pink Silicone Ultra Soft Thermal Pad In Laptop Weather Resistant

Pink Silicon Ultra Soft Thermal Pad Cooling Gap Filling Materials For Notebooks Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

1.2 W/m.K Multipurpose Thermal Conductive Pad For Laptop LED Heatsink

1.2W/m.K Thickness 0.5 mm Thermal Conductive Pad Gap Filling Materials Cooling Pad For Laptop LED Attribute Value Test Method Composition Ceramic ... 2025-01-02 00:10:25

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