Shenzhen Aochuan Technology Co., Ltd: Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan View Contact Details

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networking thermal gap filler

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Heatproof Silicone Free Thermal Pad On Laptop Thickness 1mm Practical

...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity... 2026-04-06 00:29:56

Ultrasoft Heatproof PC Thermal Pad , 1W Gap Pad Thermal Conductivity

Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2024-12-09 17:19:32

Ultrasoft Heatproof PC Thermal Pad , 1W Gap Pad Thermal Conductivity

Ultra Soft Low Resistance 1.0W/m.K Thermal Conductivity Silicon Thermal Pad Attribute Value Test Method Composition Ceramic Filler, Silicone, and ... 2026-04-06 00:29:56

Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:32

Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2024-12-09 17:19:13

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2024-12-09 17:19:13

RoHS 2.5 KN/M Thermal Isolation Pads GPU 3 mm Weather Resistant

1.0W/m.K Thermal Conductivity Ultra Soft Thermal Pad Cooling Gap Filling Materials Attribute Value Test Method Composition Ceramic Filler, Silicone, ... 2024-12-09 17:19:13

AOK Ultrasoft Heat Sink Silicone Pad , CPU Gap Pad Thermal Conductivity

Low Thermal Resistance Thermal Conductive Silicone Pad For CPU With Die-Cuting Attribute Value Test Method Composition Ceramic Filler + Silicone - ... 2026-04-06 00:29:56

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity Attribute Value Test Method Composition Ceramic Filler, ... 2026-04-06 00:29:56

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