China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
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Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

Brand Name AOK
Model Number TP800
Certification RoHS, Reach, UL
Place of Origin China
Minimum Order Quantity 1000 pcs
Payment Terms T/T
Delivery Time 13-15 working days
Packaging Details 400 mm x 200 mm
Product Name Low Thermal Resistance 8W/MK Pink Silicone Thermal Pad Material For Networking
Composition Silicone
Thermal conductivity 8.0±0.5 W/m.K
Color Pink
Hardness 55±10(Shore OO)
Flammability V-0
Detailed Product Description
Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking

 

AttributeValueTest Method
CompositionCeramic Filler + Silicone-
ColorPinkVisual
Thickness(mm)0.5~10astm d374
Density(g/cc)3.35ASTM D792
Hardness(shore oo)55±10ASTM D2240
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)>6.0ASTM D149
Dielectric Constant(@10mhz)7.2ASTM D150
Volume Resistivity(Ω.cm)1012ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)8.0±0.5ASTM D5470
 

 

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Product Tags: Tasteless Thermal Pad Material   Tasteless IC Thermal Pad Material   Networking IC Thermal Pad  
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