China Thermal Conductive Pad manufacturer
Shenzhen Aochuan Technology Co., Ltd
Shenzhen Aochuan Technology Co.,Ltd. was established in 2004, is a leading Chinese developer and manufacturer of thermal pad,thermal grease,Thermal Conductive Gap Filler,thermal interface material for
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Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

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Shenzhen Aochuan Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-0755-29765652

Contact Person:
Mr.Jason Zhan
View Contact Details

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

Brand Name AOK
Model Number UTP100
Certification RoHS, Reach, UL
Place of Origin China
Minimum Order Quantity 1000pcs
Payment Terms T/T
Delivery Time 13-15working days
Packaging Details 400mmx200mm
Product Name 1.0w/M.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch
Volume Resistivity 1.0*10^13(Ω.cm)
Flammability V-0
Thermal conductivity 1.0 W/m.K
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass
Thickness 0.5~12.0 (mm)
Detailed Product Description

1.0W/m.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch

 

AttributeValueTest Method
CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
ColorWhite and Brick RedVisual
Thickness(mm)0.5~12.0ASTM D374
Density(g/cc)2.5ASTM D792
Hardness(shore oo)30±5ASTM D2240
Tensile Strength(KN/m)2.5ASTM D624
Elongation(%)60ASTM D412
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)5.7ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)1.0±0.1ASTM D5470
 

 

Product feature:
■ the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ pink pad
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Product Tags: Practical Thermal Paste Pad   Multiscene Thermal Paste Pad   Network Silicone CPU Pad  
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