221 - 230 of 499
bga package power amplifier chip
Selling leads
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...GHz. This model provides excellent power ratings in a tiny device package (4x4x1 mm), with up to 2.5 W power handling (as a splitter) and up to 1...
2024-12-09 22:04:44
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... Mount. Specification Of IPT015N10N5 Part Number IPT015N10N5 Input Capacitance (Ciss) (Max) @ Vds 16000 pF @ 50 V Power Dissipation (Max) 375W (Tc) ...
2025-07-23 00:18:34
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...Chip TO-263-7L SiC Power MOSFET Product Description Of SCT4026DW7HRTL SCT4026DW7HRTL is Low on-resistance Automotive Grade N-channel SiC power ...
2025-07-14 00:20:06
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... for automotive & industrial applications with a frequency of 200 MHz, up to 2MB of Flash and a TQFP-100 package. Specification Of SAK-TC234L...
2025-07-23 00:18:08
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...IC Chip TPS259570DSGR Electronic Fuse Regulator 4A 8-WSON Package Product Description Of TPS259570DSGR TPS259570DSGR is eFuses (integrated FET hot ...
2025-07-23 00:18:31
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... CMOS dynamic random access memory. The memory device is designed in multi-chip package (MCP) and package stack (PoP) to save PCB space. The LPDDR4 ...
2025-07-02 00:18:46
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...Chip MT53E1G64D4NW-046 WT:C 64 Gbit SDRAM LPDDR4 Memory IC 432-VFBGA Product Description Of MT53E1G64D4NW-046 WT:C MT53E1G64D4NW-046 WT:C 64Gb low...
2025-07-02 00:18:46
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... mode is reduced to 1/5. These memory devices are designed in multi-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 ...
2025-07-02 00:18:46
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...-chip packages (MCP) and package stacks (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 configurations to save BOM ...
2025-07-02 00:18:46
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...Chip Product Description Of STM32L432KBU6 STM32L432KBU6 is Ultra-low-power with FPU Arm Cortex-M4 MCU 80 MHz with 128 Kbytes of Flash memory, USB. ...
2024-12-09 22:06:24
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